With the rapid development of microelectronic devices

electronic devices are increasingly inclined towards the direction of small

lightweight

high integration

and high heat flux density. Porous structures are widely used in the field of heat dissipation due to their ability to effectively expand heat transfer area

increase gasification core

and regulate wall wettability

thereby enhancing boiling heat transfer. Microchannel heat dissipation technology based on porous structure is a very effective and promising method for improving the performance of heat sinks. The porous structure on the surface of the microchannel

the porous material filled in the microchannel and the porous structure of the microchannel skeleton are three common structural forms in recent years that combine the porous structure with the microchannel to enhance boiling heat transfer. The porous structure mainly includes porous coating

microcavity

metal foam

porous fins and porous ribs. This article mainly reviews the research progress of microchannel heat dissipation technology based on porous structures in recent years

compares and analyzes the advantages and disadvantages of the three enhanced heat transfer structures mentioned above

elaborates on the problems faced by microchannel heat sinks in the balance design of heat transfer performance and pressure drop

and proposes relevant optimization design methods.